Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/071260
Kind Code:
A1
Abstract:
[Problem] To provide a substrate processing device that allows a uniform load to be applied to a to-be-pressured object. [Solution] A substrate processing device 1 comprises: a base part 180 that receives a load; an upper jig plate 70 that is provided with a heat source 170; a pressure application plate 80 that is attached to the upper jig plate 70 and that applies a pressure to a to-be-pressured object; and a support part 60 that is interposed between the base part 180 and the upper jig plate 70 and that supports the upper jig plate 70 for the base part 180. The support part 60 comprises support bodies 61 formed from a ceramic-based material, and an air layer 62 surrounding the support bodies 61.
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Inventors:
TANAKA YOHEI (JP)
SHINDO OSAMU (JP)
KOIZUMI HIROSHI (JP)
SAWADA MASATO (JP)
YAMASHITA MAKOTO (JP)
KATO YASUO (JP)
SHINDO OSAMU (JP)
KOIZUMI HIROSHI (JP)
SAWADA MASATO (JP)
YAMASHITA MAKOTO (JP)
KATO YASUO (JP)
Application Number:
PCT/JP2023/035294
Publication Date:
April 04, 2024
Filing Date:
September 27, 2023
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H05K13/04; H05K3/34
Foreign References:
| JP2004119594A | 2004-04-15 | |||
| JP2016162920A | 2016-09-05 | |||
| JP2019068055A | 2019-04-25 | |||
| JP2002110744A | 2002-04-12 | |||
| JP2014132648A | 2014-07-17 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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