Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/241295
Kind Code:
A1
Abstract:
A substrate processing method according to the present disclosure comprises a preparation step, an embedding step, a surface seed layer removal step, a resin material removal step and a plating step. In the preparation step, a substrate (W) is prepared, said substrate (W) being provided with a recess (501) in the surface, while being provided with a seed layer (503) on the surface and on the inner surface of the recess. In the embedding step, the recess is filled with a resin material. In the surface seed layer removal step, the seed layer formed on the surface of the substrate is removed, while protecting the seed layer formed on the inner surface of the recess by means of the resin material. In the resin material removal step, the resin material filled in the recess is removed after the surface seed layer removal step. In the plating step, the recess is filled with a plating film (506) by forming the plating film in the recess by an electroless plating method after the resin material removal step.
Inventors:
ESAKI TOMONORI (JP)
INATOMI YUICHIRO (JP)
INATOMI YUICHIRO (JP)
Application Number:
PCT/JP2020/019380
Publication Date:
December 03, 2020
Filing Date:
May 15, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/288; C23C18/16; C23C18/18; C23C18/31
Foreign References:
| US20110156270A1 | 2011-06-30 | |||
| JPH0883796A | 1996-03-26 | |||
| JP2001323381A | 2001-11-22 | |||
| JP2016207720A | 2016-12-08 | |||
| US6174813B1 | 2001-01-16 | |||
| JP2004128292A | 2004-04-22 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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