Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/199585
Kind Code:
A1
Abstract:
A processing method for a laminated substrate in which a first substrate formed by laminating a surface film and a second substrate are bonded, the method comprising: peeling from the second substrate the first substrate to be removed; and irradiating with a laser beam an exposed surface, of the surface film, that has been exposed by the peeling of the first substrate and that is left in the periphery of the second substrate, thereby removing or modifying at least a surface layer of the surface film in the periphery of the second substrate.
Inventors:
TANOUE HAYATO (JP)
YAMASHITA YOHEI (JP)
MIZOMOTO YASUTAKA (JP)
YAMASHITA YOHEI (JP)
MIZOMOTO YASUTAKA (JP)
Application Number:
PCT/JP2021/001526
Publication Date:
October 07, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B23K26/36; H01L21/02; H01L21/304
Domestic Patent References:
| WO2019176589A1 | 2019-09-19 | |||
| WO2020012986A1 | 2020-01-16 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF: