Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/223768
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a substrate processing method capable of more efficiently detaching or removing a resist from a substrate. This substrate processing method comprises: a step for supplying hydrogen peroxide to the surface of a substrate W on which a resist pattern has been formed (fig. 3B); and a step for supplying ozone gas to the hydrogen peroxide that is in contact with the substrate W (fig. 3C to 3E).
Inventors:
TANIKAWA KOTA (JP)
OTA TAKASHI (JP)
SHIBATA SHUICHI (JP)
OTA TAKASHI (JP)
SHIBATA SHUICHI (JP)
Application Number:
PCT/JP2023/015909
Publication Date:
November 23, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/027; G03F7/42; H01L21/304; H01L21/306; H01L21/3065
Foreign References:
| JP2016046531A | 2016-04-04 | |||
| JP2003077885A | 2003-03-14 | |||
| JP2003077824A | 2003-03-14 | |||
| JP2002192089A | 2002-07-10 | |||
| JP2003309098A | 2003-10-31 | |||
| JP2007149972A | 2007-06-14 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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