Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND GRINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/018854
Kind Code:
A1
Abstract:
A substrate processing method comprising: preparing a substrate having a first main surface and a second main surface opposite to the first main surface and having waviness in each of the first main surface and the second main surface; irradiating the first main surface with a first laser beam to reduce the waviness in the first main surface; and irradiating, after having reduced the waviness in the first main surface, the first main surface with a second laser beam different from the first laser beam to reduce the surface roughness of the first main surface.

More Like This:
JP2608889[Title of the Invention] A method for manufacturing a semiconductor device
JPH1098019SURFACE CLEANING
JP2510166[Name of invention] Plasma process device
Inventors:
MIZOMOTO YASUTAKA (JP)
HAYAKAWA SUSUMU (JP)
Application Number:
PCT/JP2023/023802
Publication Date:
January 25, 2024
Filing Date:
June 27, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/302; B23K26/361; B24B1/00; B24B7/04; H01L21/304; H01L21/677
Domestic Patent References:
WO2022158333A12022-07-28
Foreign References:
JP2020141088A2020-09-03
JP2010103450A2010-05-06
JP2002124490A2002-04-26
JP2002329666A2002-11-15
JP2011249652A2011-12-08
JPH0866850A1996-03-12
JP2000124176A2000-04-28
JP2023104450A2023-07-28
JP2022136730A2022-09-21
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: STATE DETECTION SYSTEM, DETECTION DEVICE, STATE DETECTION METHOD, AND PROGRAM

Next Patent: COMMUNICATION DEVICE AND COMMUNICATION METHOD