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Patent Searching and Data


Title:
SUBSTRATE-PROCESSING METHOD, SUBSTRATE-PROCESSING DEVICE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/112585
Kind Code:
A1
Abstract:
The present invention has: a step of providing a substrate having exposed on a surface thereof an electrically conductive film and an insulating film; and a step of selectively forming an oxide film on the surface of the insulating film out of the electrically conductive film and the insulating film, by supplying to the substrate a catalyst, an oxidant, and a raw material that does not contain halogen in a non-plasma atmosphere.

Inventors:
NAKATANI KIMIHIKO (JP)
HASHIMOTO YOSHITOMO (JP)
HIROSE YOSHIRO (JP)
KAWASAKI FUMIO (JP)
NAGATA KEISUKE (JP)
OOTSUKA YASUNORI (JP)
Application Number:
PCT/JP2022/042506
Publication Date:
June 22, 2023
Filing Date:
November 16, 2022
Export Citation:
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Assignee:
KOKUSAI ELECTRIC CORP (JP)
AIR WATER INC (JP)
International Classes:
C23C16/04; H01L21/316; C23C16/40; C23C16/455; H01L21/31
Foreign References:
US20150299848A12015-10-22
JP2015165523A2015-09-17
JP2021504947A2021-02-15
US20200020580A12020-01-16
US20180323102A12018-11-08
Attorney, Agent or Firm:
FUKUOKA Masahiro et al. (JP)
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