Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/061697
Kind Code:
A1
Abstract:
A substrate processing method according to this embodiment includes a fluid processing step, a first replacement step, a water repellency imparting step, a second replacement step, and a drying step. In the fluid processing step, a processing fluid that includes water is supplied to the substrate. In the first replacement step, an organic solvent of a first temperature is supplied to the post-fluid processing step substrate, and the processing fluid is replaced. In the water repellency imparting step, a water repellency imparting fluid is supplied to the post-first replacement step substrate, and the substrate is made water repellent. In the second replacement step, an organic solvent of a second temperature that is higher than the first temperature is supplied to the post-water repellency imparting step substrate, and the water repellency imparting fluid is replaced. In the drying step, the organic solvents are eliminated from the post-second replacement step substrate.
Inventors:
NAKAMORI MITSUNORI (JP)
Application Number:
PCT/JP2017/032278
Publication Date:
April 05, 2018
Filing Date:
September 07, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2016001753A | 2016-01-07 | |||
| JP2014197571A | 2014-10-16 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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