Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/061860
Kind Code:
A1
Abstract:
Provided is a technique for effectively removing organic material such as a polymer while suppressing deterioration of a structure formed on a substrate. In a modification treatment part 10, a substrate 90 is heated on the surface of which organic material such as a polymer remains, and the surface of the substrate 90 is irradiated with UV light while bringing an oxidizing gas containing an ozone gas into contact with the surface, thereby modifying the organic material such as a polymer. Thereafter, in a removal liquid processing part 20, a removal liquid is supplied to the substrate 90 which has undergone the modification treatment, thereby removing the organic material such as a polymer.
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Inventors:
TAKAHASHI HIROAKI (JP)
IWAHATA SHOTA (JP)
IWAHATA SHOTA (JP)
Application Number:
PCT/JP2017/033695
Publication Date:
April 05, 2018
Filing Date:
September 19, 2017
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2002231696A | 2002-08-16 | |||
| JP2010074168A | 2010-04-02 | |||
| JP2015537372A | 2015-12-24 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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