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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/204121
Kind Code:
A1
Abstract:
This substrate processing method comprises preparing a substrate on which a ruthenium film or ruthenium alloy film is formed, determining the attribute of the substrate, selecting a processing recipe according to the attribute of the substrate, and processing the substrate with a processing liquid on the basis of the selected processing recipe.　

Inventors:
KAGAWA KOJI (JP)
NISHIWAKI YOSHINORI (JP)
Application Number:
PCT/JP2020/015141
Publication Date:
October 08, 2020
Filing Date:
April 02, 2020
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; H01L21/308
Domestic Patent References:
WO2011074601A12011-06-23
Foreign References:
JP2001068463A2001-03-16
JP2001237389A2001-08-31
JP2006148149A2006-06-08
JP2010278386A2010-12-09
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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