Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/171931
Kind Code:
A1
Abstract:
This substrate processing method comprises: a substrate holding step for horizontally holding a substrate; a substrate rotating step for rotating the substrate being horizontally held about a rotational axis passing through a central portion of the substrate; a processing fluid supply step for supplying processing fluid selectively to a peripheral portion of the substrate in rotating state; a processing film forming step for solidifying or hardening the processing fluid supplied to the peripheral portion of the substrate, to thereby form a processing film for holding an object to be removed that is present in the peripheral portion of the substrate; and a processing film removing step for supplying a processing film removal fluid selectively to the peripheral portion of the substrate in rotating state, to remove from the peripheral portion of the substrate the processing film holding the object to be removed.
Inventors:
AKIYAMA KATSUYA (JP)
YOSHIDA YUKIFUMI (JP)
YOSHIDA YUKIFUMI (JP)
Application Number:
PCT/JP2021/003715
Publication Date:
September 02, 2021
Filing Date:
February 02, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Domestic Patent References:
| WO2019230404A1 | 2019-12-05 |
Foreign References:
| JP2013074126A | 2013-04-22 | |||
| JP2019040958A | 2019-03-14 | |||
| JP2016107272A | 2016-06-20 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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