Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/026806
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing method and a substrate processing device for suppressing breakage and chipping of a laminate substrate manufactured by joining a plurality of substrates, and particularly relates to techniques for applying a filler to a gap formed between the edges of a plurality of substrates making up the laminate substrate. The method comprises: measuring the surface shapes of an edge portion (E1) of a first substrate (W1) and an edge portion (E2) of a second substrate (W2); determining an application condition for a filler (F) to be applied to a laminate substrate (Ws), on the basis of a measurement result; and applying, under the determined application condition, the filler (F) to a gap (G) between the edge portion (E1) of the first substrate (W1) and the edge portion (E2) of the second substrate (W2) of the laminate substrate (Ws).
Inventors:
SATAKE MASAYUKI (JP)
NAKANISHI MASAYUKI (JP)
MITSUKI YUTA (JP)
NAKANISHI MASAYUKI (JP)
MITSUKI YUTA (JP)
Application Number:
PCT/JP2022/029792
Publication Date:
March 02, 2023
Filing Date:
August 03, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/02; B05C5/00; B05C9/14; B05C11/10; B05D1/26; B05D1/28; B05D3/00; B05D7/00; B05D7/24; G06N20/00; H01L21/00; H01L21/304; H01L21/66; H01L27/12
Foreign References:
| JP2014167966A | 2014-09-11 | |||
| US20080268614A1 | 2008-10-30 | |||
| JP2009253112A | 2009-10-29 | |||
| JPH05304062A | 1993-11-16 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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