SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Title:

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2024/048269

Kind Code:

A1

Abstract:

This substrate processing method includes: preparing a substrate having a surface from which a titanium nitride film and a zirconium oxide film are exposed; and selectively etching the zirconium oxide film from among the titanium nitride film and the zirconium oxide film by supplying an etching solution containing hydrogen fluoride and an organic solvent, to the surface of the substrate.

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Inventors:

KAGAWA KOJI (JP)

Application Number:

PCT/JP2023/029512

Publication Date:

March 07, 2024

Filing Date:

August 15, 2023

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)

International Classes:

H01L21/306

Domestic Patent References:

WO2018061582A1

2018-04-05

Foreign References:

JP2007157839A	2007-06-21
JP2005057276A	2005-03-03

Attorney, Agent or Firm:

ITOH, Tadashige et al. (JP)

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