Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/024925
Kind Code:
A1
Abstract:
Provided is a method with which it is possible to improve surface roughness of a metal-containing resist film that is formed on a substrate. This substrate processing method includes a step (ST1) of providing a substrate that includes a base film and a metal-containing resist film having a pattern formed therein on the base film, a step (ST2) of forming a metal-containing film on the surface of the metal-containing resist film, and a step (ST3) of removing at least a portion of the metal-containing film and residue of the metal-containing film.
Inventors:
NAKANE YUTA (JP)
KUMAKURA SHO (JP)
KUMAKURA SHO (JP)
Application Number:
PCT/JP2023/027687
Publication Date:
February 01, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027
Domestic Patent References:
| WO2016088655A1 | 2016-06-09 | |||
| WO2020137309A1 | 2020-07-02 |
Foreign References:
| JP2009505421A | 2009-02-05 | |||
| JP2021102604A | 2021-07-15 | |||
| US20200133131A1 | 2020-04-30 | |||
| US20200285148A1 | 2020-09-10 | |||
| JP2020056889A | 2020-04-09 | |||
| JP2007324384A | 2007-12-13 | |||
| JP2018060101A | 2018-04-12 | |||
| US20070196980A1 | 2007-08-23 | |||
| US20180174830A1 | 2018-06-21 | |||
| US20180068852A1 | 2018-03-08 | |||
| US20090286400A1 | 2009-11-19 |
Attorney, Agent or Firm:
SATO, Atsushi et al. (JP)
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