Title:
SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/037660
Kind Code:
A1
Abstract:
Provided is a substrate processing method for processing a substrate which has a first main surface and a second main surface on the side thereof opposite the first main surface. A polymer film is formed so as to expose the peripheral edge region of the first main surface of the substrate and to cover the inside region located adjacent to the peripheral edge region and farther toward the inside than is the peripheral edge region on the first main surface (polymer film formation step). Following the polymer film formation step, a first cleaning solution is supplied to the first main surface in a manner such that the polymer film stays on the first main surface (first cleaning solution supply step). Following the first cleaning solution supply step, a removal solution, which more easily dissolves the polymer film than does the first cleaning solution, is supplied to the first main surface (removal solution supply step).
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Inventors:
INABA MASAKI (JP)
TAHARA KANA (JP)
AKIYAMA KATSUYA (JP)
TAHARA KANA (JP)
AKIYAMA KATSUYA (JP)
Application Number:
PCT/JP2022/020462
Publication Date:
March 16, 2023
Filing Date:
May 17, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/027
Domestic Patent References:
| WO2013118536A1 | 2013-08-15 |
Foreign References:
| JP2010118519A | 2010-05-27 | |||
| JP2019158966A | 2019-09-19 | |||
| JP2008277708A | 2008-11-13 | |||
| JP2006080298A | 2006-03-23 | |||
| JP2017028201A | 2017-02-02 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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