Title:
SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/053647
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a post-etching substrate processing method wherein a generated water-insoluble material can be dissolved. One embodiment of the present disclosure relates to a substrate processing method for processing a substrate after etching, the method comprising a cleaning step in which a substrate to be processed is cleaned using a basic cleaning agent composition that contains a basic compound and water, and has a pH of 10 or more, wherein the substrate to be processed has a metal layer that contains a group 6 metal element, while having been etched with an etching liquid that contains phosphoric acid, nitric acid, water and an organic amine.
Inventors:
MURASE YUTA
OKAZAKI SHOTA
OKAZAKI SHOTA
Application Number:
PCT/JP2023/032410
Publication Date:
March 14, 2024
Filing Date:
September 05, 2023
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
H01L21/308; H01L21/304
Foreign References:
| JP2019165225A | 2019-09-26 | |||
| JP2016090753A | 2016-05-23 | |||
| JP2006164803A | 2006-06-22 | |||
| US20060229221A1 | 2006-10-12 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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