Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/004383
Kind Code:
A1
Abstract:
This substrate processing system for processing a substrate, comprises: a grinding unit for grinding a processing surface of the substrate; a thickness measurement unit for measuring a thickness of the substrate; and a control unit for controlling operation of the thickness measurement unit. The thickness measurement unit comprises: a contact measurement mechanism for contacting the processing surface of the substrate to measure the thickness of the substrate; and a contact-less measurement mechanism for measuring the thickness of the substrate without contacting the substrate. The control unit concurrently performs, in grinding processing of the substrate by the grinding unit, control of thickness measurement operation of the substrate by the contact measurement mechanism and control of measurement availability determination operation for the non-contact measurement mechanism. In the control of the measurement availability determination operation, the control unit performs control to temporally and sequentially calculate a difference value between one thickness measurement value acquired by the contact-less measurement mechanism and another thickness measurement value acquired immediately before the one thickness measurement value, determine that the thickness of the substrate can be measured when the calculated difference value continuously falls within a predetermined threshold, and start the thickness measurement operation by the contact-less measurement mechanism.
Inventors:
FUKUNAGA NOBUTAKA (JP)
Application Number:
PCT/JP2021/022847
Publication Date:
January 06, 2022
Filing Date:
June 16, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B49/04; B23Q17/20; H01L21/304
Foreign References:
| JP2011224678A | 2011-11-10 | |||
| JP2007335458A | 2007-12-27 | |||
| JP2011245610A | 2011-12-08 | |||
| JP2009233809A | 2009-10-15 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF: