Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/238542
Kind Code:
A1
Abstract:
This substrate processing system that processes a substrate comprises: a substrate-holding unit that has a holding surface that holds the substrate; a driving mechanism that moves the substrate-holding unit in a horizontal direction; a rotating mechanism that rotates the substrate-holding unit; a laser irradiation unit that irradiates a laser beam onto the substrate that is being held by the holding surface, and forms a separation surface that constitutes a starting point for separation of the substrate; and a detection mechanism that detects separation starting from the separation surface in the substrate that is being held by the substrate-holding unit.
Inventors:
MORI HIROTOSHI (JP)
YAMAWAKI YOHEI (JP)
YAMASHITA YOHEI (JP)
NAKANO SEIJI (JP)
MORIYA TERUHIKO (JP)
TAMURA TAKESHI (JP)
HAYAKAWA SUSUMU (JP)
YAMAWAKI YOHEI (JP)
YAMASHITA YOHEI (JP)
NAKANO SEIJI (JP)
MORIYA TERUHIKO (JP)
TAMURA TAKESHI (JP)
HAYAKAWA SUSUMU (JP)
Application Number:
PCT/JP2023/016360
Publication Date:
December 14, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; B23K26/57; H01L21/304; H01L21/683
Domestic Patent References:
| WO2020213479A1 | 2020-10-22 | |||
| WO2021131711A1 | 2021-07-01 | |||
| WO2021006091A1 | 2021-01-14 |
Foreign References:
| JP2021106197A | 2021-07-26 | |||
| JP2021019056A | 2021-02-15 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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