Title:
SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/193886
Kind Code:
A1
Abstract:
A substrate processing system in which prescribed processing is performed on a substrate, and a semiconductor device having a plurality of said substrates layered therein is manufactured, said substrate processing system having: a processing station where the prescribed processing is performed on the substrate; and a conveyance in/out station that is provided with a conveyance device conveying the substrate with regard to the processing station, wherein the processing station has a joining device that joins a first substrate and a second substrate among a plurality of substrates to be layered in the semiconductor device, a first board thickness reduction device that reduces the thickness of the first substrate in the combined substrate joined by the joining device, and a second board thickness reduction device that further reduces the thickness of the first substrate reduced by the first board thickness reduction device.
Inventors:
TAMURA TAKESHI (JP)
KODAMA MUNEHISA (JP)
KODAMA MUNEHISA (JP)
Application Number:
PCT/JP2019/008123
Publication Date:
October 10, 2019
Filing Date:
March 01, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; B23K20/00
Foreign References:
| JP2015126052A | 2015-07-06 | |||
| JP2009188400A | 2009-08-20 | |||
| JP2011187716A | 2011-09-22 | |||
| JP2014041957A | 2014-03-06 | |||
| JP2010157670A | 2010-07-15 | |||
| JP2011222632A | 2011-11-04 | |||
| JP2012069736A | 2012-04-05 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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