Title:
SUBSTRATE PRODUCTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/203610
Kind Code:
A1
Abstract:
This substrate production system comprises a first production facility and a second production facility. The first production facility is equipped with a first number of production lines of a first type. The production lines of the first type perform component mounting processing to mount components on substrates. The second production facility is equipped with a second number of production lines of a second type, the second number of production lines being less than the first number of production lines. The production lines of the second type perform post-processing on a substrate 1 that has undergone the component mounting processing in the production lines of the first type.
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Inventors:
HIRANO TAKASHI (JP)
Application Number:
PCT/JP2022/018060
Publication Date:
October 26, 2023
Filing Date:
April 18, 2022
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00
Domestic Patent References:
| WO2004064473A1 | 2004-07-29 |
Foreign References:
| JPH02239013A | 1990-09-21 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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