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Patent Searching and Data


Title:
SUBSTRATE SHIELD
Document Type and Number:
WIPO Patent Application WO/2013/149415
Kind Code:
A1
Abstract:
Disclosed is a substrate shield used to clamp a substrate. The substrate shield comprises a conductive sleeve body and an elastic sleeve body. The elastic sleeve body is provided with a first clamping groove in which the edge of the substrate is clamped. The conductive sleeve body is provided with a second clamping groove, and the outer surface of the elastic sleeve body is covered by the inner wall of the second clamping groove. Through clamping the substrate shield on the edge of the substrate and covering the conductive sleeve body on the outside of the elastic sleeve body, the elastic sleeve body buffers the impact when the substrate is impacted, and the conductive sleeve body can prevent the substrate from being damaged by static. Therefore, the conductive sleeve body and the elastic sleeve body can prevent the substrate from being damaged by impact or static in subsequent process or operation process.

Inventors:
CHENG WEN-DA (CN)
Application Number:
PCT/CN2012/074119
Publication Date:
October 10, 2013
Filing Date:
April 16, 2012
Export Citation:
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Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
CHENG WEN-DA (CN)
International Classes:
G02F1/1333; H05K7/18
Foreign References:
CN102043268A2011-05-04
CN2574268Y2003-09-17
CN1535107A2004-10-06
JPH0235417A1990-02-06
CN1753254A2006-03-29
JP2006064905A2006-03-09
JP2001331122A2001-11-30
Attorney, Agent or Firm:
SHENZHEN CENTURY-FOREVER INTELLECTUAL PROPERTY OFFICE (CN)
深圳市世纪恒程知识产权代理事务所 (CN)
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