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Title:
SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/008209
Kind Code:
A1
Abstract:
A substrate support according to the present invention comprises: a base; a first dielectric part which is disposed above the base and on which a substrate is to be mounted; and a second dielectric part which is disposed so as to surround the first dielectric part and on which an edge ring is to be mounted, wherein the first dielectric part and/or the second dielectric part is provided with a thermal spray layer which is made of an insulating material. A substrate processing device according to the present invention comprises a plasma treatment chamber and the substrate support, which is provided inside the plasma treatment chamber.

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Inventors:
NAGAYAMA AKIRA (JP)
KAWABATA ATSUSHI (JP)
TAKAYAMA MASATO (JP)
KAWANISHI KOJI (JP)
AKAO TAKESHI (JP)
Application Number:
PCT/JP2022/027680
Publication Date:
February 02, 2023
Filing Date:
July 14, 2022
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H02N13/00; H01L21/683; H05H1/46
Domestic Patent References:
WO2014013863A12014-01-23
WO2019239939A12019-12-19
Foreign References:
JP2018110216A2018-07-12
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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