Title:
SUBSTRATE SURFACE-MOUNTED FUSE AND METHOD FOR MANUFACTURING SUBSTRATE SURFACE-MOUNTED FUSE
Document Type and Number:
WIPO Patent Application WO/2023/119787
Kind Code:
A1
Abstract:
The present invention provides with a substrate surface-mounted fuse with which reduction in the number of components and reduction in weight and height can be achieved, and a method for manufacturing the substrate surface-mounted fuse. A substrate surface-mounted fuse 100 which comprises: a housing 110, a fusing portion 120 positioned in the housing 110, and terminal portions 130 connected to both ends of the fusing portion 120, the substrate surface-mounted fuse being mounted on the surface of a substrate 300, is characterized in that: provided are relay terminals (140, 150) connected to the substrate 300; the relay terminals (140, 150) are provided with connection portions (141, 151) connected to the terminal portions 130; recesses (146, 156) are formed in the connection portions (141, 151); and portions of the terminal portions 130 are inserted into and joined to the recesses (146, 156).
Inventors:
KAWASE FUMIYUKI (JP)
MORISHITA KAZUKI (JP)
MORISHITA KAZUKI (JP)
Application Number:
PCT/JP2022/037040
Publication Date:
June 29, 2023
Filing Date:
October 04, 2022
Export Citation:
Assignee:
PACIFIC ENG CORPORATION (JP)
International Classes:
H01H69/02; H01H85/147
Foreign References:
| JP2002163974A | 2002-06-07 | |||
| JPH05283139A | 1993-10-29 | |||
| JP2010033790A | 2010-02-12 | |||
| JPS4537329B1 | 1970-11-27 | |||
| JP2001327043A | 2001-11-22 | |||
| JP2015185243A | 2015-10-22 |
Attorney, Agent or Firm:
HIROE AND ASSOCIATES, PATENT PROFESSIONAL CORPORATION (JP)
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