Title:
SUBSTRATE TO BE ENCAPSULATED, ENCAPSULATION ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME
Document Type and Number:
WIPO Patent Application WO/2018/157622
Kind Code:
A1
Abstract:
A substrate to be encapsulated, an encapsulation assembly and a display device are provided. The substrate to be encapsulated comprises a base substrate, and a plurality of notches arranged in an array located in a region to be attached to an encapsulation layer, wherein the plurality of notches have a same shape of regular polygon.
Inventors:
DONG WANLI (CN)
YANG JIBUM (CN)
YANG JIBUM (CN)
Application Number:
PCT/CN2017/111036
Publication Date:
September 07, 2018
Filing Date:
November 15, 2017
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
H01L27/32
Foreign References:
| CN205281089U | 2016-06-01 | |||
| CN106410062A | 2017-02-15 | |||
| CN103681484A | 2014-03-26 | |||
| US20070076433A1 | 2007-04-05 |
Other References:
See also references of EP 3590137A4
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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