Title:
SUBSTRATE TREATING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/103978
Kind Code:
A1
Abstract:
A substrate treating apparatus is provided with a treatment chamber for performing heat treatment while holding a substrate with a substrate holder; an auxiliary chamber arranged adjacent to the treatment chamber; and a cooling mechanism, which has a space separated from the atmosphere in the auxiliary chamber, inside a wall plane of the auxiliary chamber, and cools the heat treated substrate carried out from the treatment chamber to the auxiliary chamber by distributing a cooling medium in the space while holding the substrate with the substrate holder.
Inventors:
NAKAGAWA NAOYUKI (JP)
DAIKOKU TAKAHIRO (JP)
DAIKOKU TAKAHIRO (JP)
Application Number:
PCT/JP2006/305606
Publication Date:
October 05, 2006
Filing Date:
March 20, 2006
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC (JP)
NAKAGAWA NAOYUKI (JP)
DAIKOKU TAKAHIRO (JP)
NAKAGAWA NAOYUKI (JP)
DAIKOKU TAKAHIRO (JP)
International Classes:
H01L21/324; H01L21/22; H01L21/31
Foreign References:
| JP2001004282A | 2001-01-12 | |||
| JP2002009000A | 2002-01-11 | |||
| JP2001002490A | 2001-01-09 | |||
| JPH01300517A | 1989-12-05 | |||
| JP2004311550A | 2004-11-04 |
Attorney, Agent or Firm:
Yui, Tohru (4-6-1 Iidabash, Chiyoda-ku Tokyo, JP)
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