Title:
SUBSTRATE TREATMENT AGENT AND METAL MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/054667
Kind Code:
A1
Abstract:
Provided is a substrate treatment agent that can impart a metal material with favorable adhesion to a laminated film. This substrate treatment agent contains a water-soluble zirconium compound, a titanium compound and a water-soluble or water-dispersible acrylic resin. The concentration of a water-soluble metal compound is 500-200,000 ppm by mass in terms of metal atoms. The water-soluble or water-dispersible acrylic resin has a molecular weight of 15,000-500,000, a solid content acid value of 150-740 mg KOH/g, and a solid content hydroxyl value of 24-350 mg KOH/g. The concentration of the water-soluble or water-dispersible acrylic resin is 500-200,000 ppm by mass in terms of solid content. The ratio of the concentration of the water-soluble metal compound in terms of metal atoms and the concentration of the water-soluble or water-dispersible acrylic resin is 3/97-91/9. The substrate treatment agent can be used to produce a laminated metal material.
Inventors:
WADA YUKO (JP)
UCHIKAWA MIWA (JP)
HIRASAWA HIDEKIMI (JP)
MATSUI NORIZUMI (JP)
SAITO KOICHI (JP)
UCHIKAWA MIWA (JP)
HIRASAWA HIDEKIMI (JP)
MATSUI NORIZUMI (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2021/032122
Publication Date:
March 17, 2022
Filing Date:
September 01, 2021
Export Citation:
Assignee:
NIPPON PAINT SURF CHEMICALS CO LTD (JP)
International Classes:
C09D5/00; B32B15/082; C09D7/61; C09D133/02; C23C26/00
Domestic Patent References:
WO2016129640A1 | 2016-08-18 | |||
WO2014057899A1 | 2014-04-17 |
Foreign References:
JP2012212511A | 2012-11-01 | |||
JP2009084516A | 2009-04-23 | |||
JP2002060699A | 2002-02-26 | |||
JP2002265821A | 2002-09-18 | |||
JP2002275648A | 2002-09-25 | |||
JP2002060975A | 2002-02-28 | |||
JP2013023702A | 2013-02-04 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND RECORDING MEDIUM
Next Patent: WAFER TEMPERATURE ADJUSTING DEVICE
Next Patent: WAFER TEMPERATURE ADJUSTING DEVICE