Title:
SUBSTRATE TREATMENT APPARATUS, METHOD FOR POSITIONING MASK, APPARATUS FOR FORMING FILM, AND METHOD FOR FORMING FILM
Document Type and Number:
WIPO Patent Application WO/2014/132831
Kind Code:
A1
Abstract:
The present invention provides a substrate treatment apparatus capable of suppressing any deterioration in the transferability of the opening pattern in a mask as caused by the generation of a gap between a substrate and the mask. An electrospray apparatus (100) (substrate treatment apparatus) is provided with a mask (3) disposed near a substrate (5) and having a predetermined opening pattern. The mask (3) is configured so that the amount of downward deflection (d2) of the mask (3) is not more than the amount of downward deflection (d1) of the substrate (5), that is, d2
Inventors:
HONDA KENSHIN (JP)
IWADE TAKASHI (JP)
IWADE TAKASHI (JP)
Application Number:
PCT/JP2014/053681
Publication Date:
September 04, 2014
Filing Date:
February 18, 2014
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B05B12/20; B05B5/08; B05B15/04; B05D1/32; H01L51/50; H05B33/10
Foreign References:
| JP2007224396A | 2007-09-06 | |||
| JP2003133069A | 2003-05-09 | |||
| JP2011002812A | 2011-01-06 |
Download PDF:
Previous Patent: IMAGE PROCESSING DEVICE, MAGNETIC RESONANCE IMAGING DEVICE, AND IMAGE PROCESSING METHOD
Next Patent: HEAT-RESISTANT GASKET
Next Patent: HEAT-RESISTANT GASKET