Title:
SUBSTRATE TREATMENT APPARATUS, SUBSTRATE TREATMENT METHOD, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2021/090721
Kind Code:
A1
Abstract:
A substrate treatment apparatus comprising: a holding rotation unit that holds and rotates a substrate; a treatment liquid supplying unit that supplies a treatment liquid to a surface of the substrate; a coating control unit that executes a supplying processing including supplying the treatment liquid to the surface of the substrate while rotating the substrate at a rotation speed dedicated to supply and a coating processing including rotating the substrate such that the treatment liquid spreads along the surface of the substrate after the treatment liquid has been supplied; a supply start detection unit that detects a supply start timing of the treatment liquid during execution of the supplying processing on the basis of a change in time of a discharge flow rate of the treatment liquid; and a condition changing unit that changes at least a supply complete timing of the treatment liquid or the rotation speed dedicated to supply on the basis of the supply start timing so as to suppress a gap between the number of rotation of the substrate during supply of the treatment liquid and the target number of rotation, the gap being caused by a gap between a supply start timing and a target timing.
Inventors:
KATO KANZO (JP)
Application Number:
PCT/JP2020/040107
Publication Date:
May 14, 2021
Filing Date:
October 26, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B05D1/40; B05D3/00; H01L21/027
Foreign References:
| JP2003145017A | 2003-05-20 | |||
| JP2019165241A | 2019-09-26 | |||
| JP2003347206A | 2003-12-05 | |||
| JP2016134566A | 2016-07-25 | |||
| JP2001126975A | 2001-05-11 | |||
| JPH10328608A | 1998-12-15 | |||
| JPH09267067A | 1997-10-14 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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