Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/093244
Kind Code:
A1
Abstract:
Provided is a substrate treatment apparatus (1), comprising: a carrier block (3) in which carriers (11) receiving a plurality of wafers W can be placed; a liquid treating unit U1 and a heat treating unit U2 for treating the wafers W; a transfer arm A2 for transferring the wafers W between a carrier and the liquid treating unit U1 or between a carrier and the heat treating unit U2; a casing (10) for housing the liquid treating unit U1, the heat treating unit U2, and the transfer arm A2; an enclosure (20) for housing the casing with a higher airtightness than that of the casing; a first pressure regulating unit (40) that regulates air pressure in the casing; a second pressure regulating unit (50) that regulates air pressure in the enclosure; and a control unit (100) that controls the first pressure regulating unit and the second pressure regulating unit so as to maintain a state in which the atmospheric pressure inside the enclosure is lower than both of the atmospheric pressure outside the enclosure and the atmospheric pressure inside the casing.
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Inventors:
KIMURA YUJI (JP)
SASAKI RYO (JP)
KANEKO SHOTA (JP)
SASAKI RYO (JP)
KANEKO SHOTA (JP)
Application Number:
PCT/JP2018/040881
Publication Date:
May 16, 2019
Filing Date:
November 02, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; B05C9/14; B05C11/10; B05C15/00; G03F7/16; H01L21/02; H01L21/677
Domestic Patent References:
| WO2015114981A1 | 2015-08-06 |
Foreign References:
| JP2008263048A | 2008-10-30 | |||
| JP2012186213A | 2012-09-27 | |||
| JP2003243159A | 2003-08-29 | |||
| JPH10272320A | 1998-10-13 | |||
| JP2002261072A | 2002-09-13 | |||
| JP2005051008A | 2005-02-24 | |||
| JP2001345255A | 2001-12-14 | |||
| JPH10135231A | 1998-05-22 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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