Title:
SUBSTRATE TREATMENT DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2022/065148
Kind Code:
A1
Abstract:
Provided is technology that makes it possible to reduce a footprint. Provided is a substrate processing device comprising modules, each provided with: a gas supply unit that includes an upstream-side flow regulation unit and a supply structure; a reaction pipe that communicates with the gas supply unit; and a gas exhaust unit which is disposed at a position facing the upstream-side flow regulation unit and which includes a downstream-side flow regulation unit and an exhaust structure. The substrate processing device also comprises: a supply pipe connected to the gas supply unit; an exhaust pipe connected to the gas exhaust unit; a transport chamber that adjoins a plurality of the modules; and a piping disposition region which is located to the side of the transport chamber and adjoins the modules, and in which the supply pipe or the exhaust pipe can be disposed. The reaction pipe is disposed at a position that overlaps with the transport chamber on a longitudinal axis of the substrate treatment device. If the supply pipe is disposed in the piping disposition region, the gas exhaust unit is disposed obliquely with respect to the axis at a position that does not overlap with the transport chamber, and if the exhaust pipe is disposed in the piping disposition region, the gas supply unit is disposed obliquely with respect to the axis at a position that does not overlap with the transport chamber.
Inventors:
MORI TAKEFUMI (JP)
TAKEBAYASHI YUJI (JP)
HIRANO MAKOTO (JP)
YAMAGUCHI TAKATOMO (JP)
OKAJIMA YUSAKU (JP)
TAKEBAYASHI YUJI (JP)
HIRANO MAKOTO (JP)
YAMAGUCHI TAKATOMO (JP)
OKAJIMA YUSAKU (JP)
Application Number:
PCT/JP2021/033875
Publication Date:
March 31, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/31; C23C16/44; H01L21/318
Domestic Patent References:
| WO2018003072A1 | 2018-01-04 |
Foreign References:
| JP2018098387A | 2018-06-21 | |||
| JP2008172205A | 2008-07-24 | |||
| JP2009123950A | 2009-06-04 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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