Title:
SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048316
Kind Code:
A1
Abstract:
A substrate treatment device according to an embodiment of the present disclosure has: a treatment container; a substrate holding unit that is disposed inside of the treatment container and that holds a substrate; a gas nozzle that sprays a gas into the treatment container; an adjustment mechanism that adjusts the distance between the substrate held by the substrate holding unit and the gas nozzle; and a control unit, wherein the control unit is configured so as to set a target value for the distance on the basis of the flow state of the gas to be sprayed from the gas nozzle and to control the adjustment mechanism such that the distance becomes the target value.
Inventors:
KAWABUCHI YOSUKE (JP)
MIYAMOTO NAOYA (JP)
MIYAMOTO NAOYA (JP)
Application Number:
PCT/JP2023/029779
Publication Date:
March 07, 2024
Filing Date:
August 18, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H01L21/304
Domestic Patent References:
| WO2020110858A1 | 2020-06-04 |
Foreign References:
| JP2020010001A | 2020-01-16 | |||
| JP2018142662A | 2018-09-13 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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