Title:
SUBSTRATE TREATMENT DEVICE, NOZZLE ASSEMBLY, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2022/130867
Kind Code:
A1
Abstract:
A substrate treatment device according to the present invention is provided with: a nozzle that is arranged along an inner wall surface of a treatment container and that is provided with a gap from the inner wall surface of the treatment container at least at a lower section of said treatment container; a nozzle base section that supports the nozzle and that has, in the interior thereof, a flow passage communicating with the nozzle; a support member that is provided along the inner wall surface and that is joined to a first joining surface of the nozzle base section, said first joining surface not facing the inner wall surface; and a slope adjusting tool configured to be capable of adjusting the slope of the nozzle base section at a position displaced toward the center of the treatment container with respect to the center of gravity of a nozzle assembly including the nozzle and the nozzle base section.
Inventors:
SHIMADA HIRONORI (JP)
TANABE MITSURO (JP)
KAGAYA TORU (JP)
HISAKADO SADAO (JP)
KANASUGI HIDEKAZU (JP)
TANABE MITSURO (JP)
KAGAYA TORU (JP)
HISAKADO SADAO (JP)
KANASUGI HIDEKAZU (JP)
Application Number:
PCT/JP2021/041846
Publication Date:
June 23, 2022
Filing Date:
November 15, 2021
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/31; C23C16/44
Foreign References:
| JP2015185578A | 2015-10-22 | |||
| JP2017157594A | 2017-09-07 | |||
| JP2010056249A | 2010-03-11 | |||
| JP2013187459A | 2013-09-19 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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