Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/168678
Kind Code:
A1
Abstract:
The present disclosure provides a substrate treatment method including: a preparation step for placing a substrate to be treated on a placement table in a treatment container; a first heating step for supplying a first gas into the treatment container and heating the substrate to be treated using a heating means; a second heating step for stopping the supply of the first gas, supplying a second gas which is different from the first gas, and heating the substrate to be treated using the heating means; and a treatment step for supplying a third gas which includes the second gas and treating the substrate to be treated.
Inventors:
KOTE KENICHI (JP)
NOGAMI TAKAFUMI (JP)
KOBAYASHI KAZUI (JP)
NOGAMI TAKAFUMI (JP)
KOBAYASHI KAZUI (JP)
Application Number:
PCT/JP2022/002674
Publication Date:
August 11, 2022
Filing Date:
January 25, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/31; C23C16/46; H01L21/316; H01L21/318
Foreign References:
| JP2003077863A | 2003-03-14 | |||
| JPH0693454A | 1994-04-05 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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