Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/026828
Kind Code:
A1
Abstract:
A substrate treatment system for treating substrates, in which: an etching solution that includes hydrofluoric acid and phosphoric acid is supplied to the surface of a substrate and the surface is etched; the etching solution is recovered after the etching process; the thickness distribution of the etched substrate is measured; and at least either hydrofluoric acid or phosphoric acid is selected and added to the etching solution recovered after etching and the compositional ratio of the etching solution is adjusted, on the basis of the measured thickness distribution.
Inventors:
UNO TAKASHI (JP)
OKAMURA NAOYUKI (JP)
MATSUKI KATSUFUMI (JP)
SAKAGUCHI KEISUKE (JP)
OKAMURA NAOYUKI (JP)
MATSUKI KATSUFUMI (JP)
SAKAGUCHI KEISUKE (JP)
Application Number:
PCT/JP2022/030135
Publication Date:
March 02, 2023
Filing Date:
August 05, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/306
Foreign References:
| JP2018117032A | 2018-07-26 | |||
| JP2016162922A | 2016-09-05 | |||
| JP2019061988A | 2019-04-18 | |||
| JP2020047857A | 2020-03-26 | |||
| JP2020167308A | 2020-10-08 | |||
| JP2018147908A | 2018-09-20 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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