Title:
SUBSTRATE WASHING METHOD AND SUBSTRATE WASHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/131581
Kind Code:
A1
Abstract:
Provided is a substrate washing method in which the process time necessary to remove foreign matter on a substrate surface can be reduced and the surface can be prevented from being irregularly ground. The substrate washing method for washing a substrate (10) by grinding the same comprises a step of conveying a first substrate (10) and a second substrate, a step of grinding the first substrate (10) by a roller grinding stone (20), and a step of grinding the second substrate by the roller grinding stone (20). In the step of grinding the first substrate (10), the roller grinding stone (20) is slid in a direction (40) perpendicular to the conveyance direction (50) of the first substrate (10) and in the longitudinal direction of the roller grinding stone (20).
Inventors:
OKAJIMA SHUNSUKE
Application Number:
PCT/JP2010/057582
Publication Date:
November 18, 2010
Filing Date:
April 28, 2010
Export Citation:
Assignee:
SHARP KK (JP)
OKAJIMA SHUNSUKE
OKAJIMA SHUNSUKE
International Classes:
B08B1/04; G02F1/13; B24B7/12; B24B7/26; G02F1/1333
Foreign References:
JP2006150549A | 2006-06-15 | |||
JPH05337796A | 1993-12-21 | |||
JPH09103942A | 1997-04-22 | |||
JPH09141214A | 1997-06-03 | |||
JP2007105799A | 2007-04-26 | |||
JPS57131244U | 1982-08-16 | |||
JPS59151649U | 1984-10-11 |
Attorney, Agent or Firm:
TESHIMA MASARU (JP)
Masaru Tejima (JP)
Masaru Tejima (JP)
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Claims: