Title:
SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/122284
Kind Code:
A1
Abstract:
The present invention has: an insulating layer (5) containing an insulating resin material; an IC component (4), which is provided with a first copper terminal (4b) on a first surface, and a second copper terminal (4d) on a second surface on the reverse side of the first surface, and which is embedded in the insulating layer; a first outer layer wiring pattern (23) formed on the first surface of the insulating layer; a second outer layer wiring pattern (24) formed on the second surface of the insulating layer, said second surface being on the reverse side of the first surface; a first copper connection section (15) that electrically connects the first copper terminal and the first outer layer wiring pattern to each other; and a second copper connection section (17) that electrically connects the second copper terminal and the second outer layer wiring pattern to each other. The first copper terminal, the first copper connection section, and a connection surface are positioned conforming to the surface shape of the first copper terminal, and the second copper terminal, the second copper connection section, and the connection surface are positioned conforming to the surface shape of the second copper terminal.
More Like This:
| JP4514301 | Manufacturing method of multi-layer wiring board |
| JPH08191186 | MULTILAYERED WIRING BOARD |
| JP2019067821 | METHOD OF MANUFACTURING PRINTED WIRING BOARD |
Inventors:
MATSUMOTO TOHRU (JP)
HASEGAWA TAKUYA (JP)
AOKI KENTARO (JP)
HASEGAWA TAKUYA (JP)
AOKI KENTARO (JP)
Application Number:
PCT/JP2016/050745
Publication Date:
July 20, 2017
Filing Date:
January 12, 2016
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H05K3/46; H01L23/12; H05K1/02
Domestic Patent References:
| WO2014162478A1 | 2014-10-09 |
Foreign References:
| JP2015015349A | 2015-01-22 |
Attorney, Agent or Firm:
NAGATO, Kanji (JP)
Download PDF:
Previous Patent: PRINTING DEVICE AND PRINTING METHOD
Next Patent: DEVELOPMENT PROGRESS MANAGEMENT DEVICE AND DEVELOPMENT PROGRESS MANAGEMENT METHOD
Next Patent: DEVELOPMENT PROGRESS MANAGEMENT DEVICE AND DEVELOPMENT PROGRESS MANAGEMENT METHOD