Title:
SUBSTRATE WITH COOLER FOR POWER MODULES AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2016/060079
Kind Code:
A1
Abstract:
Provided is a substrate with a cooler for power modules, which is prevented from the occurrence of deformation during brazing of a metal layer that is formed from copper or a copper alloy to a cooler that is formed from aluminum, and which has low thermal resistance and high bonding reliability.
A circuit layer that is formed from copper or a copper alloy is bonded to one surface of a ceramic substrate, while bonding a metal layer that is formed from copper or a copper alloy to the other surface of the ceramic substrate. A second metal layer that is formed from aluminum or an aluminum alloy is bonded to the metal layer by solid-phase diffusion, and a cooler that is formed form an aluminum alloy is joined to the second metal layer by brazing with use of an Mg-containing Al-based brazing filler material.
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Inventors:
OI SOTARO (JP)
OOHIRAKI TOMOYA (JP)
KITAHARA TAKESHI (JP)
OOHIRAKI TOMOYA (JP)
KITAHARA TAKESHI (JP)
Application Number:
PCT/JP2015/078765
Publication Date:
April 21, 2016
Filing Date:
October 09, 2015
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/36; H01L23/12
Foreign References:
| JP2012109315A | 2012-06-07 | |||
| JP2013214576A | 2013-10-17 | |||
| JP2014179463A | 2014-09-25 |
Other References:
See also references of EP 3208839A4
Attorney, Agent or Firm:
AOYAMA, MASAKAZU (JP)
Aoyama Masakazu (JP)
Aoyama Masakazu (JP)
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