Title:
SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/264596
Kind Code:
A1
Abstract:
This substrate is provided with: a film-like member which has a first main surface and a second main surface; a first electrode which has a third main surface and a fourth main surface, while being arranged such that the third main surface faces the second main surface of the film-like member; and a bonding tape which is arranged so as to face the fourth main surface of the first electrode and the second main surface of the film-like member. The first electrode has a first patterned region; the first patterned region comprises a first portion, in which the film-like member is exposed from the first electrode, and a second portion, in which the film-like member is not exposed from the first electrode; and the bonding tape is arranged so as to extend across the first portion and the second portion in the first patterned region.
Inventors:
INOUE TAKASHI (JP)
OTERA SHOZO (JP)
ISHIURA YUTAKA (JP)
ENDO JUN (JP)
NISHIZAWA YOSHIHIKO (JP)
OTERA SHOZO (JP)
ISHIURA YUTAKA (JP)
ENDO JUN (JP)
NISHIZAWA YOSHIHIKO (JP)
Application Number:
PCT/JP2022/013386
Publication Date:
December 22, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L41/047; H01L41/053; H01L41/09; H01L41/193; H01L41/29; H02N2/04
Foreign References:
| JP2011009709A | 2011-01-13 | |||
| JP2011244109A | 2011-12-01 | |||
| JP2020165887A | 2020-10-08 | |||
| JP2014072339A | 2014-04-21 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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