Title:
SUCTION PLATE
Document Type and Number:
WIPO Patent Application WO/2012/043349
Kind Code:
A1
Abstract:
[Objective] To provide a suction plate, wherein, when a ribbed wafer is sucked by the suction plate with the ribbed-side thereof facing down, the position of the ribbed wafer is not susceptible to being deviated. [Solution] The suction plate (10) has a mechanism wherein a ribbed semiconductor wafer, which is thick in ring-form at the outer circumference section at the back face thereof, and is thinner in recessed form at the inner circumference section thereof, is sucked and supported by a surface of a protruded section (14) of the suction plate (10) that fits into the recessed section. The suction plate (10) is provided with breathing notches (18) along the outer circumference of the surface of the protruded section (14).
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Inventors:
KATO TSUTOMU (JP)
Application Number:
PCT/JP2011/071555
Publication Date:
April 05, 2012
Filing Date:
September 22, 2011
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
KATO TSUTOMU (JP)
KATO TSUTOMU (JP)
International Classes:
H01L21/683
Foreign References:
| JP2007258444A | 2007-10-04 | |||
| JPH0614178U | 1994-02-22 | |||
| JPH11163107A | 1999-06-18 | |||
| JP2010016146A | 2010-01-21 | |||
| JP2009206417A | 2009-09-10 | |||
| JP2009246199A | 2009-10-22 | |||
| JPH05121384A | 1993-05-18 |
Attorney, Agent or Firm:
HATTORI, KIYOSHI (JP)
Kiyoshi Hattori (JP)
Kiyoshi Hattori (JP)
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Claims:
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