Title:
SUPER-JUNCTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/036792
Kind Code:
A1
Abstract:
The present disclosure relates to the field of power semiconductors, and particularly discloses a super-junction semiconductor device and a manufacturing method therefor. The manufacturing method comprises: etching a first predetermined region of a wafer by means of a deep trench etching process to obtain at least one Ai deep trench, and filling the Ai deep trench with a first epitaxial layer having a doping concentration of NAi to form an i-th-layer epitaxial pillar of a first conductive type; etching a second predetermined region of the wafer by means of the deep trench etching process to obtain at least one Di deep trench, and filling the Di deep trench with a second epitaxial layer having a doping concentration of NDi to form an i-th-layer epitaxial pillar of a second conductive type; and repeating the steps above to manufacture a super-junction structure in the wafer. The technical solution solves the void problem caused by the conventional single epitaxial filling of deep trenches. The method is mainly used for manufacturing a super-junction semiconductor device.
Inventors:
ZHAO DONGYAN (CN)
XIAO CHAO (CN)
CHEN YANNING (CN)
SHAO JIN (CN)
FU ZHEN (CN)
LIU FANG (CN)
TIAN JUN (CN)
ZHANG QUAN (CN)
YIN QIANG (CN)
XIAO CHAO (CN)
CHEN YANNING (CN)
SHAO JIN (CN)
FU ZHEN (CN)
LIU FANG (CN)
TIAN JUN (CN)
ZHANG QUAN (CN)
YIN QIANG (CN)
Application Number:
PCT/CN2022/132497
Publication Date:
February 22, 2024
Filing Date:
November 17, 2022
Export Citation:
Assignee:
BEIJING SMARTCHIP MICROELECTRONICS TECH CO LTD (CN)
BEIJING CHIP IDENTIFICATION TECH CO LTD (CN)
STATE GRID CORP CHINA (CN)
BEIJING CHIP IDENTIFICATION TECH CO LTD (CN)
STATE GRID CORP CHINA (CN)
International Classes:
H01L21/336; H01L29/06; H01L29/78
Domestic Patent References:
| WO2018107429A1 | 2018-06-21 |
Foreign References:
| CN115064446A | 2022-09-16 | |||
| CN106684120A | 2017-05-17 | |||
| CN114823531A | 2022-07-29 | |||
| CN111863623A | 2020-10-30 | |||
| US20060043481A1 | 2006-03-02 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
Download PDF: