Title:
SUPERCONDUCTING DEVICE, SUPERCONDUCTING DEVICE MANUFACTURING METHOD, AND LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2022/201253
Kind Code:
A1
Abstract:
The present invention provides a superconducting device including a substrate, a through hole formed in the substrate, and a through electrode provided in the through hole. The through electrode includes a first part and a second part disposed between the first part and an inner wall of the through hole. The second part is formed of a material including a first metal that exhibits superconductivity at a temperature lower than or equal to a predetermined temperature. The superconducting device includes: a junction electrode at least a part of which is disposed outside of the through hole, the junction electrode being electrically connected to the through electrode and formed of a material including a second metal that exhibits superconductivity at a temperature lower than or equal to the predetermined temperature; and a partition wall disposed between the through electrode and the junction electrode and formed of a material including the first metal. The melting point of the first metal is higher than the melting point of the second metal.
Inventors:
NAKAMURA MAKOTO (JP)
Application Number:
PCT/JP2021/011752
Publication Date:
September 29, 2022
Filing Date:
March 22, 2021
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
H01L39/02
Foreign References:
| JP2019504511A | 2019-02-14 | |||
| JPH11177157A | 1999-07-02 | |||
| JPH0269994A | 1990-03-08 | |||
| JP2020520090A | 2020-07-02 | |||
| JPS5397798A | 1978-08-26 | |||
| JP2020520090A | 2020-04-06 |
Other References:
See also references of EP 4318618A4
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (JP)
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