Title:
SUPPORT SINK APPLICATION METHOD FOR 3D PRINTING HEAT DISSIPATION ANALYSIS
Document Type and Number:
WIPO Patent Application WO/2023/113450
Kind Code:
A1
Abstract:
A support sink application method for 3D printing heat dissipation analysis is provided. The support sink application method according to an embodiment of the present invention comprises the steps in which: a support sink application system adds a support sink in order to simulate heat dissipation using a support in a state where a support shape is not generated in a 3D model; the support sink application system performs heat dissipation simulation with the support sink added to the 3D model; and the support sink application system adjusts the support sink on the basis of the result of the simulation. Therefore, the convenience of heat dissipation simulation can be improved by introducing the support sink capable of representing heat dissipation by the support with no support shape. In addition, due to dependency reduction caused by a support change, it is not necessary to reanalyze a target model (shape) even when a support is added/moved/deleted, and thus the convenience of heat dissipation simulation can be improved.
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Inventors:
SHIN HWA SEON (KR)
SHIN JAE HO (KR)
LEE HYE IN (KR)
CHUN SUNG HWAN (KR)
PARK SUNG HUN (KR)
SHIN JAE HO (KR)
LEE HYE IN (KR)
CHUN SUNG HWAN (KR)
PARK SUNG HUN (KR)
Application Number:
PCT/KR2022/020291
Publication Date:
June 22, 2023
Filing Date:
December 14, 2022
Export Citation:
Assignee:
KOREA ELECTRONICS TECHNOLOGY (KR)
International Classes:
B22F12/20; B22F3/10; B33Y40/00
Foreign References:
| KR20200119416A | 2020-10-20 | |||
| JP2017530027A | 2017-10-12 | |||
| JP2020075506A | 2020-05-21 | |||
| KR102236149B1 | 2021-04-06 | |||
| KR20180018702A | 2018-02-21 |
Attorney, Agent or Firm:
NAM, Choong Woo (KR)
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