Title:
SUPPORTED PCD AND MANUFACTURING METHOD USING BINDERLESS WC-SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/011771
Kind Code:
A3
Abstract:
An exemplary cutting element incorporates a non-magnetic and electrically conductive substrate on which a layer of polycrystalline diamond particles is sintered to the substrate. An exemplary method of forming a cutting element comprises sintering the substrate, a layer of diamond particles and a catalyst source at a pressure greater than 20 kbar and a temperature greater than 1200 QC to form a layer of polycrystalline diamond particles bonded to the substrate. Cutting elements incorporating non-magnetic and electrically conductive substrates can be sectioned using ablation techniques, such as laser cutting.
Inventors:
WEBB STEVEN W (US)
Application Number:
PCT/US2010/043197
Publication Date:
June 23, 2011
Filing Date:
July 26, 2010
Export Citation:
Assignee:
DIAMOND INNOVATIONS INC (US)
WEBB STEVEN W (US)
WEBB STEVEN W (US)
International Classes:
E21B10/567; C22C26/00; C22C29/08
Foreign References:
| US20050050801A1 | 2005-03-10 | |||
| DE4437053A1 | 1996-02-08 | |||
| JP2003300778A | 2003-10-21 |
Other References:
ZHU W ET AL: "CHARACTERIZATION OF DIAMOND FILMS ON BINDERLESS W-MO COMPOSITE CARBIDE", DIAMOND AND RELATED MATERIALS, ELSEVIER SCIENCE PUBLISHERS, AMSTERDAM, NL, vol. 3, no. 10, 1 October 1994 (1994-10-01), pages 1270 - 1276, XP000476306, ISSN: 0925-9635, DOI: 10.1016/0925-9635(94)90133-3
Attorney, Agent or Firm:
GASAWAY, Maria, C. (Inc.6325 Huntley Roa, Worthington OH, US)
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