Title:
SUPRAMOLECULAR POLYMERIZABLE PHOTOCURABLE RESIN FOR HIGHLY DURABLE 3D PRINTING, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/101702
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to a supramolecular polymerizable photocurable resin for highly durable 3D printing, and a method for manufacturing same. More specifically, provided are a supramolecular polymerizable photocurable resin for highly durable 3D printing having a polymer network structure, and a method for manufacturing same, the supramolecular polymerizable photocurable resin being characterized in that the mechanical properties of the supramolecular polymerizable photocurable resin can be improved by using a design principle of large monomers capable of supramolecular polymerization beyond simple supramolecular bonding.
Inventors:
KANG JI HEONG (KR)
LEE HAE SEUNG (KR)
KIM JI YUN (KR)
LEE HAE SEUNG (KR)
KIM JI YUN (KR)
Application Number:
PCT/KR2023/016075
Publication Date:
May 16, 2024
Filing Date:
October 17, 2023
Export Citation:
Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
C08G77/28; B29C64/129; B33Y10/00; B33Y70/00; C08G77/20; C08G77/26
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
Download PDF: