Title:
SURFACE-EMITTING DEVICE, DISPLAY DEVICE, SEALING MEMBER SHEET FOR SURFACE-EMITTING DEVICE, AND METHOD FOR MANUFACTURING SURFACE-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/085668
Kind Code:
A1
Abstract:
The present disclosure provides a surface-emitting device comprising: a light emitting diode substrate (4) comprising a support substrate (2) and a light emitting diode element (3) disposed on one surface side of the support substrate (2); a sealing member (5) disposed on the light emitting diode element side of the light emitting diode substrate (4) and sealing the light emitting diode element; and a diffusion member (6) disposed on a surface side of the sealing member (5) opposite the light emitting diode substrate side. The sealing member (5) has a haze value of greater than or equal to 4%, and a thickness greater than the thickness of the light emitting diode element (3).
Inventors:
ARIHARA KEITA (JP)
NISHIKAWA MARII (JP)
TSUZUKI ATSUO (JP)
KANAI YOSHIHIRO (JP)
NISHIKAWA MARII (JP)
TSUZUKI ATSUO (JP)
KANAI YOSHIHIRO (JP)
Application Number:
PCT/JP2021/038555
Publication Date:
April 28, 2022
Filing Date:
October 19, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01L33/56; B32B7/023; B32B27/00; B32B27/18; B32B27/32; B32B27/36; F21S2/00; F21V19/00; G02F1/13357; F21Y105/10; F21Y115/10
Foreign References:
| US20190326265A1 | 2019-10-24 | |||
| CN109254451A | 2019-01-22 | |||
| JP2014502291A | 2014-01-30 | |||
| JP2018127561A | 2018-08-16 | |||
| JP2014148584A | 2014-08-21 | |||
| JP2013200398A | 2013-10-03 | |||
| JP2016087791A | 2016-05-23 | |||
| JP2021138825A | 2021-09-16 |
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
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