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Patent Searching and Data


Title:
SURFACE MODIFIER COMPOSITION AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/069915
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a surface modifier composition which can modify the surfaces of various adhesion-resistant materials, and thereby improve adhesion to various adhesion-resistant materials, and a bonding method using the surface modifier composition. The present invention pertains to a surface modifier composition used for modifying the surface of an adherend containing a resin having a hydrocarbon bond, the composition containing component (A) that is a hydrogen-abstraction radical initiator, component (B) that is a silane compound having a hydrolyzable silyl group, and one or more of at least one type of functional groups selected from the group consisting of radical polymerizable functional groups and a mercapto group, component (C) that is at least one compound selected from the group consisting of (C1) specific silane compounds and (C2) condensation reaction catalysts.

Inventors:
SOGA TETSUNORI (JP)
Application Number:
PCT/JP2018/036867
Publication Date:
April 11, 2019
Filing Date:
October 02, 2018
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09D4/00; C09D5/00; C09D143/04; C09D183/04; C09J5/02; C09J5/06; C09J109/00; C09J123/22; C09J133/00; C09J157/00; C09J183/04
Foreign References:
JPS57195108A1982-11-30
JP2011013607A2011-01-20
JP2013065553A2013-04-11
JPS54133585A1979-10-17
JP2010512558A2010-04-22
JP2013040291A2013-02-28
JP2000109584A2000-04-18
JP2000109584A2000-04-18
JP2017195896A2017-11-02
Other References:
See also references of EP 3693416A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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