Title:
SURFACE MOUNTED COMPONENT MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2005/101931
Kind Code:
A1
Abstract:
The sizes of a structure for firmly mounting an electronic component on a printed circuit board are reduced. The structure is provided with the printed circuit board (7), the electronic component (12) which is surface-mounted on the printed circuit board (7),and a shield case (13) which covers the electronic component (12) and is fixed on the printed circuit board (7) to shield the electronic component (12), and a resin injection opening (20) provided on the shield case (13). A resin (14) injected from the resin injection opening (20) hardens in the shield case (13) and the electronic component (12) adheres on the printed circuit board (7).
Inventors:
KOYANAGI MOTOYOSHI (JP)
KAGATA KENJI (JP)
SATOU KOUHEI (JP)
KOYAMA MASATO (JP)
KAGATA KENJI (JP)
SATOU KOUHEI (JP)
KOYAMA MASATO (JP)
Application Number:
PCT/JP2004/005352
Publication Date:
October 27, 2005
Filing Date:
April 15, 2004
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
KOYANAGI MOTOYOSHI (JP)
KAGATA KENJI (JP)
SATOU KOUHEI (JP)
KOYAMA MASATO (JP)
KOYANAGI MOTOYOSHI (JP)
KAGATA KENJI (JP)
SATOU KOUHEI (JP)
KOYAMA MASATO (JP)
International Classes:
H05K3/28; H05K5/00; H05K9/00; H04M1/02; (IPC1-7): H05K3/28; H05K5/00; H05K9/00
Foreign References:
| JP2000151083A | 2000-05-30 | |||
| JPH06268724A | 1994-09-22 | |||
| JPH04114494A | 1992-04-15 |
Attorney, Agent or Firm:
Takahashi, Shogo c/o Mitsubishi Denki Kabushiki kaisha Corporate Intellectual Property Division (7-3 Marunouchi 2-chom, Chiyoda-ku Tokyo 10, JP)
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