Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SURFACE-MOUNTING MACHINE USING OPTICAL BEAM
Document Type and Number:
WIPO Patent Application WO/2010/018680
Kind Code:
A1
Abstract:
Disclosed is a surface-mounting machine (10) that is suitable for electronic components having terminals to which the solder is already attached, and particularly for rear surface contact type electronic components. The machine is equipped with a laser head (200) that irradiates a solder bump terminal (101) of a BGA electronic component (100) and the lands (103) of a printed wiring board (107) with a laser beam, and an adhesion nozzle (353) that, after the laser beam has been emitted by the laser head (200), lowers the BGA electronic component (100), stopping in close proximity to the printed wiring board (107) and releases the component to place same on the printed wiring board (107).

More Like This:
JP3314475PRESSURE DEVICE
WO/2023/195174PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE
Inventors:
KONDOU YUTAKA (JP)
ICHIKAWA KAZUNORI (JP)
Application Number:
PCT/JP2009/003826
Publication Date:
February 18, 2010
Filing Date:
August 07, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
YAMAHA MOTOR CO LTD (JP)
KONDOU YUTAKA (JP)
ICHIKAWA KAZUNORI (JP)
International Classes:
H05K3/34; B23K1/00; B23K1/005; B23K3/00; B23K101/42
Foreign References:
JPS60257587A1985-12-19
JPH10335806A1998-12-18
JP2003092465A2003-03-28
JPH03156938A1991-07-04
JPH04219943A1992-08-11
JPH10190210A1998-07-21
Attorney, Agent or Firm:
UEBA, Hidetoshi et al. (JP)
Hidetoshi Ueha (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH SURFACE-MOUNT COMPONENT MOUNTED THEREON

Next Patent: RESIN COMPOSITION