Title:
SURFACE-PROTECTING ADHESIVE SHEET, AND METHOD FOR USING SURFACE-PROTECTING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2015/079903
Kind Code:
A1
Abstract:
Provided is a surface-protecting adhesive sheet which can be easily bonded to the surface of an electronic device with little need for external force, and which can be easily re-bonded. This surface-protecting adhesive sheet is provided with, on one surface of a base material, an adhesive layer comprising a cured product of an adhesive composition, and is characterized by the following: the adhesive composition containing at least a silyl-terminated polymer as component (A), a silane coupling agent as component (B), and a curing catalyst as component (C); the silyl-terminated polymer, which is component (A), having a prescribed structure; and if the adhesive composition contains a tackifying resin as component (D), the blending quantity of this tackifying resin being less than 10 parts by weight relative to 100 parts by weight of the silyl-terminated polymer, which is component (A), or by not containing a tackifying resin.
Inventors:
IKEDA HANAKO (JP)
YAMAGUCHI SEITARO (JP)
KAWADA SATOSHI (JP)
OTAKA SYO (JP)
MIYATA SOU (JP)
YAMAGUCHI SEITARO (JP)
KAWADA SATOSHI (JP)
OTAKA SYO (JP)
MIYATA SOU (JP)
Application Number:
PCT/JP2014/079845
Publication Date:
June 04, 2015
Filing Date:
November 11, 2014
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; C09J11/06; C09J11/08; C09J171/02; C09J175/02; C09J175/08; C09J183/00; C09J183/12; C09J193/00; C09J193/04; G09F9/00
Domestic Patent References:
| WO2010026995A1 | 2010-03-11 | |||
| WO2008123552A1 | 2008-10-16 |
Foreign References:
| JP2010111862A | 2010-05-20 | |||
| JP2011006630A | 2011-01-13 | |||
| JP2000109676A | 2000-04-18 | |||
| JP2011219765A | 2011-11-04 | |||
| JP2011006644A | 2011-01-13 |
Attorney, Agent or Firm:
EMORI Kenji et al. (JP)
Kenji Emori (JP)
Kenji Emori (JP)
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