Title:
SURFACE PROTECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/013688
Kind Code:
A1
Abstract:
This surface protection method is a method in which the surface of a member to be protected which is to be heat treated, said member being either an optical member or an electronic member, is protected by a surface protective film, wherein the surface protective film comprises a substrate and an adhesive layer made from an energy-ray curable adhesive composition and provided to one surface of the substrate. The surface protective film is adhered to the surface of the member to be protected, with the adhesive layer interposed therebetween, and after the adhesive layer of the surface protective film adhered to the surface is cured by energy-rays, the member to be protected to which the surface protective film is affixed is heat-treated.
Inventors:
HORIGOME KATSUHIKO (JP)
TOMINAGA TOMOCHIKA (JP)
TOMINAGA TOMOCHIKA (JP)
Application Number:
PCT/JP2015/075803
Publication Date:
January 28, 2016
Filing Date:
September 11, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J5/06; C09J7/20; C09J133/06
Domestic Patent References:
| WO2009066435A1 | 2009-05-28 |
Foreign References:
| JP2000129227A | 2000-05-09 | |||
| JP2007246848A | 2007-09-27 | |||
| JP2011124480A | 2011-06-23 | |||
| JPH09330940A | 1997-12-22 | |||
| JP2005244118A | 2005-09-08 | |||
| JPH1117158A | 1999-01-22 | |||
| JPH0827239A | 1996-01-30 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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