Title:
SURFACE-PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/244796
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a surface-protective film which has high adhesive force (initial adhesive force) and which, after having been applied to an adherend, is less apt to increase in adhesive force with the lapse of time or even at high temperatures and can be removed therefrom without leaving an adhesive residue. This surface-protective film comprises a substrate layer and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer, when examined by a CPMG method at 60°C using pulsed NMR, has an L-component content of 10% or less and a relaxation time of 25-80 msec and, when examined by a solid echo method at 25°C using pulsed NMR, has an L-component content of 30-65% and a relaxation time of 0.2-0.4 msec.
Inventors:
KOYANO HARU (JP)
GUO JIAMO (JP)
HARADA MISATO (JP)
YAMAMOTO TAIZOU (JP)
NAMBA YUKIKO (JP)
NAKAJIMA NAMI (JP)
GUO JIAMO (JP)
HARADA MISATO (JP)
YAMAMOTO TAIZOU (JP)
NAMBA YUKIKO (JP)
NAKAJIMA NAMI (JP)
Application Number:
PCT/JP2022/020631
Publication Date:
November 24, 2022
Filing Date:
May 18, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J7/38; C08F297/04; C09J11/08; C09J153/02
Foreign References:
| JP2010214853A | 2010-09-30 | |||
| JP2017120427A | 2017-07-06 | |||
| JP2003342441A | 2003-12-03 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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